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High Temp ESD Waffle Trays for Semiconductor ICs

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High Temp ESD Waffle Trays for Semiconductor ICs

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Ic Type : BGA,QFP,QFN,LGA,PGA

Model Number : HN24199

Mold Type : Injection

Capacity : 7x7=49 PCS

Certification : ROHS, ISO

Brand Name : Hiner-pack

Reusable : Yes

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Payment Terms : T/T

Color : Black

Cavity Size : 4.1x4x0.9 mm

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Outline Line Size : 50.8×50.8×3.94 mm

Tray Shape : Rectangular

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Packaging Details : CARTON, PALLET

Packing Level : Transport package

Warpage : Warpage MAX 0.2mm

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High Temp ESD Waffle Trays for Semiconductor ICs
Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.

Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.

Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.
Key Features/ Benefits
  • ESD protection
  • High temperature resistance
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24199
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 4.1x4x0.9 mm
Matrix QTY 7x7=49 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.

Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.
Packaging & Shipping/ Services
Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.

Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Quality High Temp ESD Waffle Trays for Semiconductor ICs for sale

High Temp ESD Waffle Trays for Semiconductor ICs Images

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