Sign In | Join Free | My infospaceinc.com
China Shenzhen Hiner Technology Co., Ltd. logo
Shenzhen Hiner Technology Co., Ltd.
Verified Supplier

6 Years
Home > Waffle Pack Chip Trays >

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Product Categories
Shenzhen Hiner Technology Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Model Number : HN24200

Mold Type : Injection

Capacity : 5x7=35 PCS

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Ic Type : BGA,QFP,QFN,LGA,PGA

Payment Terms : T/T

Color : Black

Cavity Size : 6.7X4.0X1.07 mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Certification : ROHS, ISO

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Outline Line Size : 50.8×50.8×3.94 mm

Brand Name : Hiner-pack

Reusable : Yes

Tray Shape : Rectangular

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Packaging Details : CARTON, PALLET

Packing Level : Transport package

Warpage : Warpage MAX 0.26mm

Contact Now

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Feature uniform grid design to hold fine pitch ICs steadily without shifting. Fit various industrial processes and protect sensitive components from damage during daily operation.

Bring reliable performance for long-term use and reduce component loss in production and transfer. Match automatic equipment to improve working efficiency effectively.

Accept customized cavity size and layout to meet different chip requirements. Focus on practical protection to satisfy diverse production demands.
Key Features/ Benefits
  • Secure component fixing
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24200
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.7X4.0X1.07 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work stably in automatic industrial systems and daily manufacturing processes.

Applied in semiconductor factories, electronic assembly plants and chip packaging workshops. Ideal for industrial production, internal transportation and long-term component storage.
Packaging & Shipping/ Services
Packed in standard cartons with protective inner layers to avoid scratches and deformation. Support safe stacking for bulk transportation.

Available for sea, air and international express shipping. Ensure products arrive in good condition and ready for immediate industrial use.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Quality Durable Grid Waffle Trays for Safe Fine Pitch IC Handling for sale

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Hiner Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like