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ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

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ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

MOQ : 1000

Capacity : 10x10=100 PCS

Incoterms : EXW, FOB, CIF, DDU, DDP

Payment Terms : T/T

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Warpage : Warpage MAX 0.21mm

Model Number : HN24187

Reusable : Yes

Packing Level : Transport package

Tray Shape : Rectangular

Supply Ability : 2000PCS/Day

Ic Type : BGA,QFP,QFN,LGA,PGA

Cavity Size : 1.57x0.98x0.41 mm

Brand Name : Hiner-pack

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Outline Line Size : 50.8×50.8×4 mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Clean Class : General And Ultrasonic Cleaning

Mold Type : Injection

Place of Origin : China

Color : Black

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Secure ESD-Safe IC Chip Trays for Semiconductor Storage

Deliver precision cavity structure to hold delicate IC chips firmly, preventing shifting and electrostatic damage during handling. Built with durable material for consistent performance in industrial environments. Provide reliable ESD protection for sensitive semiconductor components. Seeking secure trays for safe chip storage?


Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in chip loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.


Support fully customized cavity size and layout to match specific chip dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect IC chips throughout transit.

Key Features/ Benefits
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Protects delicate fine pitch IC components efficiently
  • ESD-safe design
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24187
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4 mm
Cavity Size 1.57x0.98x0.41 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Support semiconductor die attach, device testing, cleanroom assembly, and precision component kitting operations. Pair seamlessly with pick-and-place machines, Class 100 cleanroom environments, and ESD-controlled production lines.


Also used for finished IC inventory storage, inter-plant component transport, and international shipping of electrostatic-sensitive devices. Serve semiconductor fabs, OSATs, and global electronic component distributors.

Customized Services
Provide fully tailored solutions for ESD-safe IC waffle trays. Modify cavity dimensions, spacing, and layout to fit diverse die sizes and packaging needs.

Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to optimize production and shipping workflows.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

ESD-Safe IC Chip Tray

      

Precision Cavity Waffle Pack Tray

      

Reusable Semiconductor Tray

      
Quality ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage for sale

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