JEDEC IC trays protect wafers for clean production.
JEDEC IC Tray is manufactured with MPPO material. It provides reliable protection for wafers against contamination and impact during production, handling and transfer. The tray complies with standard JEDEC specifications and helps maintain a clean production environment for semiconductor applications.
It is widely used in semiconductor packaging, testing, storage and transportation. It performs well in cleanroom conditions and works smoothly with automated production equipment to ensure wafer integrity.
Customization is a core service. We support tailored sizes, structures and designs to meet diverse production requirements and improve overall production efficiency.
Key Features/ Benefits
- Strong durable structure
- Effective dust prevention
- Safeguard wafer packaging processes
- Clean production support
- Flexible customization
Specifications
| Brand |
Hiner-pack |
| Model |
HN25020 |
| Material |
MPPO |
| Package Type |
JEDEC |
| Color |
Black |
| Resistance |
1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size |
322.6×135.9×7.62 mm |
| Cavity Size |
48×45×2.75 mm |
| Matrix QTY |
2X6=12 PCS |
| Warpage |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Custom Pocket Options |
Available |
Applications
Widely used in wafer packaging, die sorting, semiconductor assembly and cleanroom processing. Perfect for high-precision production lines in semiconductor packaging and integrated circuit manufacturing.
Also applied in inter-plant wafer transportation, finished chip storage and logistics shipping. Serve IC packaging factories, semiconductor manufacturers and electronic component logistics providers.
Customized Services
Provide professional customization for JEDEC IC trays according to wafer size and production needs. Customize cavity shape, depth and arrangement to ensure perfect fit.
Select high-performance materials for anti-static, high temperature or cleanroom use. Support prototype verification and mass production. Offer full custom solutions for packaging and transportation.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
