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JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging

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JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging

Name: JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging
Brand: Hiner-pack
Price: 1.35 USD

Quality JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging for sale

Color : Black

Model Number : HN25046

Reusable : Yes

Flatness : Less than 0.76mm

Payment Terms : T/T

Mold Type : Injection

Capacity : 7x15=105 PCS

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Tray Shape : Rectangular

Packing Level : Transport package

Supply Ability : 2000PCS/Day

Quality Assurance : Delivery Guarantee, Reliable Quality

Certification : ROHS, ISO

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

MOQ : 500 pcs

Delivery Time : 10 workdays

Cavity Size : 322.6×135.9×7.62 mm

Place of Origin : China

Ic Type : BGA,QFP,QFN,LGA,PGA

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Brand Name : Hiner-pack

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JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging

JEDEC IC Tray is engineered to minimize dust contamination, keeping semiconductor components clean throughout packaging processes. Sturdy structure ensures reliable protection against impacts and scratches during handling.

JEDEC IC Tray meets strict JEDEC standards, guaranteeing compatibility with automated production lines. It maintains component integrity, reducing waste and supporting consistent quality control.

JEDEC IC Tray adapts to diverse component sizes with customizable cavity designs. Whether for high-volume manufacturing or precision storage, it provides clean, durable protection for sensitive semiconductor parts.

Key Features/ Benefits

Deliver durable construction.
Dust reduction and anti-contamination
RoHS compliant materials
Comply with JEDEC standards.
Support custom design solutions.

Specifications

Brand		Hiner-pack
Model		HN25046
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		11.8×13.7×3.1 mm
Matrix QTY		7x15=105 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC IC Tray is ideal for semiconductor packaging, clean room manufacturing, and IC testing lines. It prevents dust buildup, maintaining component purity during high-precision production.

JEDEC IC Tray also supports component storage and logistics, offering stable protection during transport. Custom cavities secure components, minimizing damage and ensuring performance remains intact until assembly.

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts to protect products during transit. Customized packaging solutions are available upon request to meet specific handling and storage needs.

All shipments are tracked and handled by trusted carriers for reliable worldwide delivery. Professional logistics support ensures timely, safe arrival of orders, with efficient customs clearance and documentation for international shipments.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging Images

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