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Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping

Shenzhen Hiner Technology Co., Ltd.
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Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping

Model Number : HN25050

Reusable : Yes

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Cavity Size : 322.6×135.9×7.5 mm

Payment Terms : T/T

Color : Black

Incoterms : EXW, FOB, CIF, DDU, DDP

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)

Quality Assurance : Delivery Guarantee, Reliable Quality

MOQ : 500 pcs

Delivery Time : 10 workdays

Mold Type : Injection

Packing Level : Transport package

Place of Origin : China

Ic Type : BGA,QFP,QFN,LGA,PGA

Packaging Details : CARTON, PALLET

Clean Class : General And Ultrasonic Cleaning

Certification : ROHS, ISO

Brand Name : Hiner-pack

Tray Shape : Rectangular

Flatness : Less than 0.76mm

Capacity : 4x1=4 PCS

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Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping

Durable JEDEC IC Tray keeps semiconductor components safe from dust and physical harm during packaging and shipping. Sturdy build withstands impacts and scratches, preserving component integrity from production to delivery.

Durable JEDEC IC Tray meets strict JEDEC standards, ensuring seamless compatibility with automated packaging lines. It reduces component failure rates, supporting consistent quality control across all stages.

Durable JEDEC IC Tray adapts to diverse component sizes with customizable cavities. Whether for high-volume production or long-distance shipping, it delivers reliable, clean protection for sensitive electronic parts.
Key Features/ Benefits
  • RoHS compliant materials
  • Dust and contamination control
  • Customizable cavity design
  • Secure component retention
  • Durable impact-resistant construction
Specifications
Brand Hiner-pack
Model HN25050
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.5 mm
Cavity Size 55.52×74.6×1.6 mm
Matrix QTY 4x1=4 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Durable JEDEC IC Tray is ideal for semiconductor packaging lines, clean room manufacturing, and global logistics. It prevents dust buildup and physical damage, maintaining component purity during production and long-distance shipping.

Durable JEDEC IC Tray also supports in-process handling and storage, offering stable protection between production steps. Custom cavities hold components firmly, minimizing shifting and impact during automated packaging and shipping operations.
Packaging & Shipping/ Services
Durable JEDEC IC Trays are packaged in anti-static, durable materials with secure stacking and cushioning inserts. Custom packaging solutions are available to meet specific handling and storage requirements.

All shipments are tracked and handled by trusted carriers for reliable worldwide delivery. Professional logistics support ensures timely, safe arrival, with efficient customs clearance and documentation for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Quality Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping for sale

Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping Images

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