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Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly

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Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly

Model Number : HN25047

Color : Black

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Mold Type : Injection

Capacity : 10x23=230 PCS

MOQ : 500

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Payment Terms : T/T

Reusable : Yes

Flatness : Less than 0.76mm

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Tray Shape : Rectangular

Packing Level : Transport package

Brand Name : Hiner-pack

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Place of Origin : China

Cavity Size : 7.5×6.5×2.05 mm

Packaging Details : CARTON, PALLET

Ic Type : BGA,QFP,QFN,LGA,PGA

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Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly
Durable JEDEC IC Tray keeps semiconductor components clean by reducing dust buildup during packaging and assembly. Sturdy build withstands frequent handling, shielding parts from scratches and impacts.

Durable JEDEC IC Tray follows JEDEC standards, ensuring smooth integration with automated production lines. It lowers component damage rates, supporting consistent quality across manufacturing stages.

Durable JEDEC IC Tray fits diverse component sizes with customizable cavities. Whether for high-volume runs or precision assembly, it delivers reliable, dust-free protection for sensitive electronic parts.
Key Features/ Benefits
  • Deliver durable construction.
  • Dust reduction and anti-contamination
  • Customizable cavity layouts
  • Secure component retention
  • JEDEC standard compliance
Specifications
Brand Hiner-pack
Model HN25047
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 7.5×6.5×2.05 mm
Matrix QTY 10x23=230 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Durable JEDEC IC Tray works perfectly for semiconductor packaging lines, IC assembly facilities, and clean room manufacturing. It prevents dust contamination, preserving component purity during high-precision production.

Durable JEDEC IC Tray also supports in-process handling and storage, offering stable protection between production steps. Custom cavities hold components firmly, minimizing shifting and damage during automated assembly operations.
Packaging & Shipping/ Services
Durable JEDEC IC Tray offers full customization to match unique production requirements. Adjust cavity size, pitch, and layout to fit specific component dimensions and automated line workflows.

Engineering team collaborates closely to develop tailored tray solutions, from prototype to mass production. Add custom markings, mounting holes, or anti-slip features to optimize dust control and handling efficiency in packaging and assembly.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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