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Specialized JEDEC IC Trays For Wafer Level Packaging & Clean IC Protection

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Specialized JEDEC IC Trays For Wafer Level Packaging & Clean IC Protection

Tray Shape : Rectangular

Packing Level : Transport package

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Brand Name : Hiner-pack

Packaging Details : CARTON, PALLET

Capacity : 11x14=264 PCS

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Color : Usually black or dark gray for ESD protection

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Reusable : Yes

Place of Origin : China

MOQ : 500

Payment Terms : T/T

Mold Type : Injection

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 20.36x3.3x1.89 mm

Model Number : HN24227

Delivery Time : 10 workdays

Flatness : Less than 0.76mm

Ic Type : BGA,QFP,QFN,LGA,PGA

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Specialized JEDEC IC Trays For Wafer Level Packaging & Clean IC Protection
Specialized JEDEC IC Trays perfectly fit semiconductor wafer level packaging production. They adapt well to high-standard cleanroom environments, and effectively reduce dust contamination to protect chip integrity.

Ultra-low particle generation performance keeps inner working conditions clean. They maintain stable performance for IC components during whole wafer processing procedures.

Reliable ESD anti-static protection is equipped for daily use. Custom cavity designs are also available, making them ideal choices for cleanroom wafer level packaging work.
Key Features/ Benefits
  • Ultra Low Particle Generation
  • Cleanroom Wafer Level Compatibility
  • Stable ESD Anti-Static Protection
  • Custom Cavity Pocket
  • Design Reliable IC Chip Protection
Specifications
Brand Hiner-pack
Model HN24227
Material PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×10.6 mm
Cavity Size 20.36x3.3x1.89 mm
Matrix QTY 11x14=264 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays offer complete chip protection throughout semiconductor manufacturing and transportation processes. They are highly suitable for ESD-sensitive semiconductor devices used in strict cleanroom environments.

JEDEC trays are widely applied to wafer-level packaging processing, cleanroom chip handling operations and daily production in semiconductor manufacturing factories.
Wafer-level packaging
  • Ultra Low Particle Generation
  • Cleanroom Wafer Level Compatibility
  • Stable ESD Anti-Static Protection
  • Custom Cavity Pocket Design
  • High Reliable Chip Protection
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Quality Specialized JEDEC IC Trays For Wafer Level Packaging & Clean IC Protection for sale

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