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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Reusable : Yes

Flatness : Less than 0.76mm

Model Number : HN25001

Place of Origin : China

MOQ : 500

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Mold Type : Injection

Capacity : 7x12=84 PCS

Delivery Time : 10 workdays

Tray Shape : Rectangular

Packing Level : Transport package

Payment Terms : T/T

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Packaging Details : CARTON, PALLET

Brand Name : Hiner-pack

Ic Type : BGA,QFP,QFN,LGA,PGA

Certification : ROHS, ISO

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Supply Ability : 2000PCS/Day

Cavity Size : 16×9.5×4.72 mm

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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection
Reduce dust contamination effectively. Protect delicate semiconductor components during wafer level packaging. Offer reliable structural durability for repeated industrial use. Need stable IC tray solutions for clean production?

Fit automated semiconductor packaging lines. Adapt to wafer level processing and component handling workflows. Maintain cleanroom compatibility and consistent performance.

Support safe component storage and logistics. Offer customizable cavity layouts and sizes. Create tailored JEDEC tray designs to match unique packaging requirements.
Key Features/ Benefits
  • Deliver durable construction.
  • Reduce dust contamination.
  • Safeguard wafer packaging processes.
  • Comply with JEDEC standards.
  • Support custom design solutions.
Specifications
Brand Hiner-pack
Model HN25001
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×12.19 mm
Cavity Size 16×9.5×4.72 mm
Matrix QTY 7x12=84 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Quality Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection for sale

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection Images

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