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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Name: Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection
Brand: Hiner-pack
Price: 1.35 USD

Quality Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection for sale

Brand Name : Hiner-pack

Model Number : HN25001

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 322.6×135.9×12.19 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Flatness : Less than 0.76mm

Capacity : 7x12=84 PCS

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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Reduce dust contamination effectively. Protect delicate semiconductor components during wafer level packaging. Offer reliable structural durability for repeated industrial use. Need stable IC tray solutions for clean production?

Fit automated semiconductor packaging lines. Adapt to wafer level processing and component handling workflows. Maintain cleanroom compatibility and consistent performance.

Support safe component storage and logistics. Offer customizable cavity layouts and sizes. Create tailored JEDEC tray designs to match unique packaging requirements.

Key Features/ Benefits

Deliver durable construction.
Reduce dust contamination.
Safeguard wafer packaging processes.
Comply with JEDEC standards.
Support custom design solutions.

Specifications

Brand		Hiner-pack
Model		HN25001
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×12.19 mm
Cavity Size		16×9.5×4.72 mm
Matrix QTY		7x12=84 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection Images

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