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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Color : Black

Payment Terms : T/T

Mold Type : Injection

Capacity : 7x23=161 PCS

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

MOQ : 500

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Place of Origin : China

Packaging Details : CARTON, PALLET

Reusable : Yes

Flatness : Less than 0.76mm

Delivery Time : 10 workdays

Tray Shape : Rectangular

Packing Level : Transport package

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Ic Type : BGA,QFP,QFN,LGA,PGA

Brand Name : Hiner-pack

Model Number : HN25004

Cavity Size : 13×7.5×7.62 mm

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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term industrial use. Searching for dependable tray solutions for semiconductor production?

Fit high-standard manufacturing environments and automated production lines. Ensure stable performance during wafer handling and transfer processes. Adapt to various semiconductor packaging procedures smoothly.

Support safe storage and transportation of wafers. Accept customized sizes and structures to meet different production needs. Provide tailored solutions for diverse semiconductor packaging requirements.
Key Features/ Benefits
  • Strong durable structure
  • Stable wafer protection
  • Safeguard wafer packaging processes
  • Comply with JEDEC standards
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25004
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 13×7.5×7.62 mm
Matrix QTY 7x23=161 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Widely used in semiconductor wafer packaging, chip testing, die sorting and device manufacturing. Suitable for cleanroom production, automated assembly lines and high-precision processing workshops. Perfectly match various wafer level packaging processes and ensure stable performance in strict production environments.

Also applied to wafer storage, factory logistics, production turnover and sample delivery. Meet requirements of semiconductor packaging plants, testing centers and electronic component manufacturers. Support safe and efficient operation of the whole semiconductor production and supply chain.
Customized Services
Provide professional customized services for JEDEC IC trays according to customer needs. Support personalized design of cavity size, arrangement and material. Create exclusive tray structures for different wafers and packaging processes. Offer one-stop tailored solutions to improve production efficiency and meet special application requirements in semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Quality Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging for sale

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging Images

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