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High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

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High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

Brand Name : Hiner-pack

Model Number : HN24164

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Color : Usually black

Quality Assurance : Delivery Guarantee, Reliable Quality

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Warpage : Warpage MAX 0.24mm

Capacity : 10x20=200 PCS

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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

High precision cleanroom waffle pack trays fit strict semiconductor cleanroom production standards. Delivers powerful particulate contamination isolation performance for ultra-fine pitch fragile IC components. Do you need professional precision holders to guard valuable chips from pollution damage during manufacturing?


Features standardized JEDEC elongated grid cavity structure. Resists scratches, static interference and dust invasion effectively. Maintains stable clean performance across chip handling, transfer and daily storage procedures.


Owns durable stackable precision loading design. Fully adapts semiconductor packaging, testing, logistics transportation and inventory demands. Preserves complete clean intact status of high-value sensitive IC chips in whole industrial chains.

Key Features/ Benefits
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Adopts high-precision elongated JEDEC grid structure
  • Protects ultra-delicate fine pitch ESD-sensitive IC chips
Specifications
Brand Hiner-pack
Model HN24164
Color Usually black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Matrix QTY 10x20=200 PCS
Cavity Size 3.00X0.7X0.22
Warpage MAX 0.24mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.


With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services
Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

cleanroom waffle pack trays

      

high precision IC storage trays

      

contamination control chip trays

      
Quality High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage for sale

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