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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Model Number : HN24150

Incoterms : EXW, FOB, CIF, DDU, DDP

Packing Level : Transport package

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Mold Type : Injection

Reusable : Yes

Packaging Details : CARTON, PALLET

Color : Usually black or dark gray for ESD protection

Brand Name : Hiner-pack

Delivery Time : 10 workdays

Quality Assurance : Delivery Guarantee, Reliable Quality

Warpage : Warpage MAX 0.2mm

Place of Origin : China

Tray Shape : Rectangular

Supply Ability : 2000PCS/Day

Ic Type : BGA,QFP,QFN,LGA,PGA

Clean Class : General And Ultrasonic Cleaning

Certification : ROHS, ISO

Capacity : 18x12=216 PCS

Payment Terms : T/T

MOQ : 1000

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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Cleanroom waffle pack IC trays adapts to strict semiconductor cleanroom production environments. Meets international cleanroom-grade standards, provides reliable contamination control performance for delicate fine pitch IC chips.


Adopts standardized JEDEC precise grid cavity structure. Prevents dust pollution damage effectively, maintains stable performance during daily chip storage, handling and transfer procedures.


Supports fully customized cavity layouts for diverse chip specifications. Owns excellent anti-static performance, perfectly matches semiconductor packaging, testing and logistics needs, offers long-lasting stable protection for high-value precision IC chips.

Key Features/ Benefits
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24150
Material MPPO
Color Usually black or dark gray for ESD protection
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Matrix QTY 18x12=216 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.


With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services
Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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Quality Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage for sale

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