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High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

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High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

Brand Name : Hiner-pack

Model Number : HN24136

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Outline Line Size : 50.7×50.7×7.4 mm

Cavity Size : 3.00x0.70x0.30 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Warpage : Warpage MAX 0.3mm

Capacity : 9x19=171 PCS

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High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

High-Precision Cleanroom Waffle Trays meet strict cleanroom industry standards. Trays deliver excellent contamination control performance, and offer safe stable handling for delicate precision IC chips.


High-Precision Cleanroom Waffle Trays own compact precise grid structure. Trays effectively prevent dust pollution damage, and perfectly fit semiconductor manufacturing and testing processes.


High-Precision Cleanroom Waffle Trays support customized cavity designs. Trays protect fragile fine pitch chips well, and ensure stable reliable use in cleanroom logistics and storage.

Key Features/ Benefits
  • Anti-static & dust-proof design for safe chip handling
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Cleanroom-grade contamination control to protect sensitive ICs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24136
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 3.00x0.70x0.30 mm
Matrix QTY 9x19=171 PCS
Warpage

MAX 0.3mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-Grade Waffle Pack Chip Trays deliver reliable IC protection through the whole semiconductor manufacturing and transportation process. Trays feature great contamination control performance, ESD anti-static protection, and fully protect delicate fine pitch chip devices.

Trays are widely applied to fine pitch IC packaging (QFN, BGA, CSP bare die), JEDEC compatible automated pick-and-place production lines, semiconductor inspection & testing procedures, as well as cleanroom IC logistics transportation and daily storage management.
Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Quality High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention for sale

High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention Images

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