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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Mold Type : Injection

Model Number : HN24132

Payment Terms : T/T

Color : Usually black or dark gray for ESD protection

Reusable : Yes

Brand Name : Hiner-pack

Certification : ROHS, ISO

Capacity : 9x7=63 PCS

Packaging Details : CARTON, PALLET

Place of Origin : China

MOQ : 1000

Tray Shape : Rectangular

Ic Type : BGA,QFP,QFN,LGA,PGA

Incoterms : EXW, FOB, CIF, DDU, DDP

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Clean Class : General And Ultrasonic Cleaning

Cavity Size : 5.0x3.35x1.20 mm

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Warpage : Warpage MAX 0.2mm

Packing Level : Transport package

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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.


Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.


Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24132
MaterialMPPO
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×7.4 mm
Cavity Size5.0x3.35x1.20 mm
Matrix QTY9x7=63 PCS
WarpageMAX 0.2mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Quality Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control for sale

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